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INTEGRATED CIRCUITS
DATA SHEET
TDA2616/TDA2616Q 2 x 12 W hi-fi audio power amplifiers with mute
Product specification File under Integrated Circuits, IC01 July 1994
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifiers with mute
FEATURES * Requires very few external components * No switch-on/switch-off clicks * Input mute during switch-on and switch-off * Low offset voltage between output and ground * Excellent gain balance of both amplifiers * Hi-fi in accordance with IEC 268 and DIN 45500 * Short-circuit proof and thermal protected * Mute possibility. QUICK REFERENCE DATA Stereo application SYMBOL VP PO Gv Gv SVRR Vno PARAMETER supply voltage range output power internal voltage gain channel unbalance channel separation supply voltage ripple rejection noise output voltage VP = 16 V; THD = 0.5% CONDITIONS
TDA2616/TDA2616Q
GENERAL DESCRIPTION The TDA2616 and TDA2616Q are dual power amplifiers. The TDA2616 is supplied in a 9-lead single-in-line (SIL9) plastic power package (SOT131), while the TDA2616Q is supplied in a 9-lead SIL-bent-to-DIL plastic power package (SOT157). They have been especially designed for mains fed applications, such as stereo radio and stereo TV.
MIN. 7.5 - - - - - -
TYP. - 12 30 0.2 70 60 70
MAX. 21 - - - - - -
UNIT V W dB dB dB dB V
ORDERING INFORMATION EXTENDED TYPE NUMBER TDA2616 TDA2616Q Notes 1. SOT131-2; 1996 August 27. 2. SOT157-2; 1996 August 27. PACKAGE PINS 9 9 PIN POSITION SIL SIL-bent-to-DIL MATERIAL plastic plastic CODE SOT131(1) SOT157(2)
July 1994
2
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifiers with mute
TDA2616/TDA2616Q
+ VP
handbook, full pagewidth
7 VA V ref1
TDA2616
680 VB INV1 1 20 k 4 k 5 k V ref3 10 k + V ref2 1/2 V P / GND 3 Vref1 voltage comparator 10 k - V ref2 - VP 20 k 9 8 680 VB - VP - VP
20 k CM
4
OUT1
MUTE
2
+ VP
+ VP THERMAL PROTECTION
VA V B
6 CM
OUT2
INV2 INV1, 2
20 k
V ref1 VA 5
MCD375 - 1
- VP
Fig.1 Block diagram.
July 1994
3
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifiers with mute
PINNING SYMBOL -INV1 MUTE 1/2VP/GND OUT1 -VP OUT2 +VP INV1, 2 -INV2 PIN 1 2 3 4 5 6 7 8 9 DESCRIPTION non-inverting input 1 mute input 1/2 supply voltage or ground output 1 supply voltage (negative) output 2 supply voltage (positive) inverting inputs 1 and 2 non-inverting input 2
TDA2616/TDA2616Q
FUNCTIONAL DESCRIPTION The TDA2616 is a hi-fi stereo amplifier designed for mains fed applications, such as stereo radio and TV. The circuit is optimally designed for symmetrical power supplies, but is also well-suited to asymmetrical power supply systems. An output power of 2 x 12 W (THD = 0.5%) can be delivered into an 8 load with a symmetrical power supply of 16 V. The gain is internally fixed at 30 dB, thus offering a low gain spread and a very good gain balance between the two amplifiers (0.2 dB). A special feature is the input mute circuit. This circuit disconnects the non-inverting inputs when the supply voltage drops below 6 V, while the amplifier still retains its DC operating adjustment. The circuit features suppression of unwanted signals at the inputs, during switch-on and switch-off. The mute circuit can also be activated via pin 2. When a current of 300 A is present at pin 2, the circuit is in the mute condition. The device is provided with two thermal protection circuits. One circuit measures the average temperature of the crystal and the other measures the momentary temperature of the power transistors. These control circuits attack at temperatures in excess of +150 C, so a crystal operating temperature of max. +150 C can be used without extra distortion. With the derating value of 2.5 K/W, the heatsink can be calculated as follows: at RL = 8 and VP = 16 V, the measured maximum dissipation is 14.6 W. With a maximum ambient temperature of +65 C, the thermal resistance of the heatsink is: 150 - 65 R th = --------------------- - 2.5 = 3.3 K/W. 14.6 The internal metal block has the same potential as pin 5.
handbook, halfpage
INV1 MUTE 1/2 VP / GND OUT1 VP OUT2 + VP INV1, 2 INV2
1 2 3 4 5 6 7 8 9
MCD372 - 1
TDA2616
Fig.2 Pin configuration.
July 1994
4
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifiers with mute
LIMITING VALUES In accordance with the Absolute maximum System (IEC 134). SYMBOL VP IOSM Ptot Tstg TXTAL Tamb tsc supply voltage non-repetitive peak output current total power dissipation storage temperature range crystal temperature ambient operating temperature range short circuit time see Fig.3 PARAMETER CONDITIONS
TDA2616/TDA2616Q
MIN. - - - -55 - -25
MAX. 21 4 25 +150 +150 150 1
UNIT V A W C C C h
short-circuit to ground; note 1
-
Note to the limiting values 1. For asymmetrical power supplies (with the load short-circuited), the maximum unloaded supply voltage is limited to VP = 28 V and with an internal supply resistance of RS 4 , the maximum unloaded supply voltage is limited to 32 V (with the load short-circuited). For symmetrical power supplies the circuit is short-circuit-proof up to VP = 21 V.
MCD376 - 2
handbook, halfpage
32
Ptot (W) 24 infinite heatsink
16 R th-hs= 3.3 K/W
8
0 - 25
0
50
100
150
Tamb ( o C)
Fig.3 Power derating curve.
THERMAL RESISTANCE SYMBOL Rth j-a July 1994 PARAMETER from junction to ambient in free air 5 THERMAL RESISTANCE 2.5 K/W
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifiers with mute
CHARACTERISTICS SYMBOL Supply VP IORM VP IP PO supply voltage range repetitive peak output current PARAMETER CONDITIONS
TDA2616/TDA2616Q
MIN. - -
TYP.
MAX.
UNIT
16 2.2
21 -
V A
Operating position; note 1 supply voltage range total quiescent current output power THD = 0.5% THD = 10% THD B Gv Gv Vno Zi SVRR Ibias VGND V4-6 VO Z2-7 IP Vno SVRR VGND Voff I2 VP IP VO Vno SVRR total harmonic distortion power bandwidth voltage gain gain unbalance noise output voltage input impedance supply voltage ripple rejection channel separation input bias current DC output offset voltage DC output offset voltage between two channels note 4 RS = 0 note 3 PO = 6 W THD = 0.5%; note 2 10 12 - - 29 - - 14 40 46 - - - - 6.7 18 - 40 - - - 12 15 0.15 20 to 20 000 30 0.2 70 20 60 70 0.3 30 4 - - 0.2 - 31 1 140 26 - - - 200 150 W W % Hz dB dB V k dB dB A mV mV RL = 7.5 18 16 40 21 70 V mA
MUTE POSITION (AT IMUTE 300 A) output voltage mute input impedance total quiescent current noise output voltage supply voltage ripple rejection DC output offset voltage offset voltage with respect to operating position current if pin 2 is connected to pin 5 VI = 600 mV note 7 RL = note 3 note 4 0.3 9 40 70 55 40 4 - - 30 0.3 70 55 1.0 11.3 70 140 - 200 150 8.2 mV k mA V dB mV mV mA
Mute position; note 5 supply voltage range total quiescent current output voltage noise output voltage supply voltage ripple rejection RL = VI = 600 mV note 3 note 4 2 9 - - 40 5.8 40 1.0 140 - V mA mV V dB
July 1994
6
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifiers with mute
SYMBOL VGND IP PO PARAMETER DC output offset voltage CONDITIONS
TDA2616/TDA2616Q
MIN. - 40
TYP.
MAX. 200
UNIT mV
Operating position; note 6 total quiescent current output power THD = 0.5% THD = 10% THD = 0.5%; RL = 4 THD = 10%; RL = 4 THD B Gv Gv Vno Zi SVRR VO Z2-7 IP Vno SVRR Voff I2 total harmonic distortion power bandwidth voltage gain gain unbalance noise output voltage input impedance supply voltage ripple rejection channel separation note 3 PO = 4 W THD = 0.5%; note 2 5 6.5 - - - - 29 - - 14 35 - VI = 600 mV note 7 note 3 note 4 - 6.7 18 - 35 - - 6 8 10 14 0.13 40 to 20 000 30 0.2 70 20 44 45 - - - - 0.2 - 31 1 140 26 - - 1.0 11.3 70 140 - 150 8.2 W W W W % Hz dB dB V k dB dB 18 40 70 mA
MUTE POSITION (IMUTE 300 A) output voltage mute input impedance total quiescent current noise output voltage supply voltage ripple rejection offset voltage with respect to operating position current if pin 2 is connected to pin 5 0.3 9 40 70 44 4 - mV k mA V dB mV mA
Notes to the characteristics 1. VP = 16 V; RL = 8 ; Tamb = 25 C; f = 1 kHz; symmetrical power supply IMUTE < 30 A. See Fig.4 2. The power bandwidth is measured at an output power of PO max - 3 dB 3. The noise output voltage (RMS value) is measured at RS = 2 k, unweighted (20 Hz to 20 kHz) 4. The ripple rejection is measured at RS = 0 and f = 100 Hz to 20 kHz. The ripple voltage (200 mV) is applied in phase to the positive and the negative supply rails. With asymmetrical power supplies, the ripple rejection is measured at f = 1 kHz 5. VP = 4 V; RL = 8 ; Tamb = 25 C; f = 1 kHz; symmetrical power supply. See Fig.4 6. VP = 24 V; RL = 8 ; Tamb = 25 C; f = 1 kHz; asymmetrical power supply IMUTE < 30 A. See Fig.5 7. The internal network at pin 2 is a resistor devider of typical 4 k and 5 k to the positive supply rail. At the connection of the 4 k and 5 k resistor a zener diode of typical 6.6 V is also connected to the positive supply rail. The spread of the zener voltage is 6.1 to 7.1 V.
July 1994
7
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifiers with mute
TDA2616/TDA2616Q
handbook, full pagewidth
mute input 2 680 7 20 k 2200 F
+ VP
220 nF VI
4 1 22 nF 20 k 3 20 k
TDA2616
8.2
R L= 8 100 nF
220 nF VI
9 6 22 nF 8 680 20 k 8.2 5 - VP 2200 F
MCD374 - 3
R L= 8
Fig.4 Test and application circuit with symmetrical power supply.
July 1994
8
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifiers with mute
TDA2616/TDA2616Q
handbook, full pagewidth
mute input 2 680
VP 100 nF 7 20 k
RS 2200 F
VS
220 nF VI
4 1 22 nF 20 k 3 8.2 internal 1/2 VP 20 k 680 F R L= 8
100 F
TDA2616
220 nF VI
9 6 22 nF 8 680 20 k 8.2 5 680 F R L= 8
MCD373 - 2
Fig.5 Test and application circuit with asymmetrical power supply.
July 1994
9
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifiers with mute
PACKAGE OUTLINES SIL9P: plastic single in-line power package; 9 leads
TDA2616/TDA2616Q
SOT131-2
non-concave x Dh
D Eh
view B: mounting base side d A2
B seating plane j E
A1 b
L
c 1 Z e bp wM 0 5 scale DIMENSIONS (mm are the original dimensions) UNIT mm A1 max. 2.0 A2 4.6 4.2 b max. 1.1 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 Eh 6 j 3.4 3.1 L 17.2 16.5 Q 2.1 1.8 w 0.25 x 0.03 Z (1) 2.00 1.45 10 mm 9 Q
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT131-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-03-11
July 1994
10
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifiers with mute
TDA2616/TDA2616Q
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm)
SOT157-2
non-concave D x Dh
Eh
view B: mounting base side
d
A2
B j E A
L3
L
Q c
1 Z e1 e bp wM
9 m e2 vM
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 5.08 e1 e2 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.25 x 0.03 Z (1) 2.00 1.45
2.54 5.08
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT157-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-10-12 95-03-11
July 1994
11
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifiers with mute
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA2616/TDA2616Q
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
July 1994
12

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